Capabilities Built Around Precision and Control
A Facility Structured for Controlled Operations
3,000 Sq. Ft. Plating Facility
Dedicated Operational Areas
NC Segregation Area
In-House Transport Facilities
Client and Logistics Access
Quality Verified Through Measurement and Monitoring
Our quality systems combine plating-thickness measurement, visual inspection, bath validation, chemical analysis and daily process monitoring to support controlled electroplating outcomes.
XRF Plating Thickness Measurement
X-Ray Fluorescence measurement for precise, micron-level thickness verification on every batch.
Digital Microscope Inspection
100% visual inspection at up to 40x magnification to check surface uniformity, pinholes, nodules and contamination.
Hull Cell Test
Plating-bath chemistry validation to establish suitable process parameters before production runs.
Volumetric Analysis
Chemical analysis of plating-bath composition to maintain solution quality.
Daily Bath Monitoring
Daily monitoring of pH, density, temperature and TDS to maintain process stability.
Salt Spray Chamber
On-demand corrosion-resistance testing through our sister concern, K-Lite India.
Profile Projector
Dimensional verification of plated components through K-Lite India.






Research Partnerships Supporting Surface Innovation
Our R&D collaborations connect us with leading institutions in electrochemistry, advanced materials and surface finishing, supporting continued development in electroplating processes.
CECRI (CSIR)
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Central Electrochemical Research Institute, specialising in electrochemistry research.
IGCAR
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Indira Gandhi Centre for Atomic Research, focused on nuclear and advanced-materials research.
CFCT (ARCI)
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Research collaboration in powder metallurgy, new materials and related surface technologies.
IIT Madras Research Centre
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Collaboration on advanced surface-finishing processes.
Bring Your Plating Requirement to Our Team
Talk to us about your component, material and required finish, and take the next step towards the right electroplating solution.